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Fraunhofer Institute for Solar Energy Systems ISE reduced silver consumption in TOPCon solar cells to 1.1 mg per W peak. Current TOPCon cells typically require 10 to 12 mg per W, creating cost pressure for manufacturers. The research team tested an electroplating-based inline metallization process developed with RENA Technologies GmbH. The approach combined ultrashort UV laser structuring with nickel, copper, and minimal silver deposition. The team produced M10-sized TOPCon solar cells with 24% efficiency, matching conventional screen-printed reference cells. A fill factor of 82.1 ± 0.3% was achieved across 186 solar cells. Nickel acted as a diffusion barrier, copper handled electrical conduction, and silver served as oxidation protection. Electroplated copper contacts could nearly replace silver requirements in TOPCon solar cells. Fraunhofer ISE expects nickel-copper electroplating to be adopted within two to three years. The process may also reduce reliance on silver paste supply chains concentrated in China. The research was conducted under the EURO and SHINE PV projects, demonstrating industrial-scale feasibility.
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